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摘要
The deformation behavior of W-Cu material during high-pressure torsion (HPT) was simulated by ABAQUS software. The distributions of stress and equivalent strain, as well as the influence of applied pressure and deformation temperature on the strain accumulation of interface layer were analyzed. The simulation results show that shear deformation mainly occurs on copper during HPT process, but has little influence on tungsten, and the strain accumulation of interface layer is the largest. The increase of deformation temperature varying from 300 ℃ to 500 ℃ and applied pressure varying from 1 GPa to 3 GPa has positive effect on the strain accumulation of interface layer, but the effect of temperature increase is not significant, and higher temperature and applied pressure may lead to the extrusion of copper and the failure of HPT die. At the same time, the W-Cu gradient material with noble bonding interface is obtained through 5 turns of HPT processing at 300 ℃ and 1 GPa. The experimental results show that with the increase of torsion radius, the microstructures of W and Cu are significantly refined to 32.6 and 0.28 μm, respectively. Also, a transition layer of Cu with grain size of 4.8~6.75 μm can be found at the interface. The interface of tungsten and copper is well combined, and the diffusion distances of tungsten and copper on the bonding interface are 1.74 and 2.59 μm, respectively. The microhardness (HV) of copper increases from 790 MPa to 1310 MPa, and that of tungsten at the interface increases from 3470 MPa to 4240 MPa, which indicates that grain refinement and defect accumulation under large deformation condition are beneficial to interface bonding and performance improvement.
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