Electroconductive, Adhesive, Non‐Swelling, and Viscoelastic Hydrogels for Bioelectronics (Adv. Mater. 4/2023)

作者:Han Im Kyung; Song KangIl; Jung SangMun; Jo Yeonggwon; Kwon Jaesub; Chung Taehun; Yoo Surim; Jang Jinah; Kim YongTae; Hwang Dong Soo; Kim Youn Soo
来源:Advanced Materials, 2023, 35(4).
DOI:10.1002/ADMA.202370028