Fabrication and Characterization of Cu-Diamond Composite Layer on CuCr0.5 Substrate [CuCr0.5表面制备Cu-Diamond层及其性能]

作者：Qiu W.^*; Li H.; Hong T.; Liu Z.; Zhong X.; Jiao D.; Zhou K.

来源：Rare Metal Materials and Engineering, 2018, 47(11): 3554-3558.

• CuCr0.5
• Diamond
• Groove
• Mold pressing

A Cu-Diamond composite layer was fabricated on CuCr0.5 alloy substrate by electroplating a Cu-diamond composite 'planting sands' layer, and the diamond particles were pressed into CuCr0.5 substrate by molding. The "V" grooves were filled with the nano-copper grains suspending in water and the composite layer was mould pressed to fix the nano-copper powder on Cu-diamond layer. Finally the sample was sintered at 900℃/60 min in Ar+H 2 (10vol%) protecting atmosphere. The surface morphology at different fabricating stages was investigated by scanning electron microscopy (SEM) and the surface thermal expansion coefficient of the Cu-diamond composite layer was tested by electric resistance strain gauge method. The results show that the "V" grooves are formed at the vicinity of substrate/diamond interface after molding of Cu-diamond composite layer fabricated using W40 diamond powder. The "V" grooves can be perfectly filled by the nano-copper grains filling, mould pressing and sintering at 900℃/60 min. The surface thermal expansion coefficient of the Cu-diamond composite layer is 11.7×10 -6 /℃ when the volume percent of W40 diamond particles on Cu-diamond layer is 40%~45%.

• 单位
  华南理工大学