科研之友
微信
新浪微博
Facebook
分享链接
摘要
this research was developed to evaluate the potential use of the woods schizolobium amazonicum (paric芍) and cecropia hololeuca (emba迆ba) for manufacturing particleboard. were made panels with the densities of 0.70 g/cm3, using mixtures of urea-formaldehyde resin and wood particles of paric芍 and emba迆ba, in proportions of 75, 50 and 25%. the pinus taeda wood was used as the reference. the panels were pressed at the temperature of 160oc, pressure of 40 kgf/cm2, for 8 minutes. the evaluations of the properties of water absorption, thickness swelling, internal bond, modulus of elasticity and modulus of ruptures, showed that the woods of schizolobium amazonicum (paric芍) e cecropia hololeuca (emba迆ba) are technically feasible for particleboard manufacture.
