科研之友
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摘要
Deep ultraviolet light-emitting diodes （DUV-LEDs） can physically destroy the structure of viruses and bacteria， thus achieving efficient disinfection. Compared with the mature blue LED process， how to improve the packaging reliability and light output efficiency of DUV-LEDs is still a key problem. In this paper， a semi-inorganic packaging DUV-LED was prepared by using substrate preheating method of micro-cured encapsulation adhesive and combining with array dispensation method to bond quartz glass in plated dam copper. The output wavelength of the device is 275 nm and its half-peak width is approximately 11 nm. Quartz-packaged DUV-LEDs have higher light output than traditional devices packaged with transparent materials. DUV-LED devices using the packaging technique presented herein exhibit high air hermeticity in vacuum red ink and helium environments. Moreover， in the accelerated aging test， the light decay rate of this packaged device is less than 20%. Experimental results show that using array dispensing to bond quartz glass under substrate preheating is a packaging method to improve the reliability of DUV-LEDs compared with organic packaging. ? 2023 Chines Academy of Sciences.
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