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摘要
The phenolic resin was modified by silane coupling agent KH560 to prepare KH560 modified phenolic resin. The effect of KH560 on the thermal and mechanical properties of phenolic resin were investigated by Fourier transform infrared spectroscope, thermogravimetry analyzer, and mechanical property tests. The results show that the phenolic resin decomposes at 318 ℃ when the mass fraction of KH560 modifier is 2.5%, and the mass loss is approximately 17.0%, which represents better thermal resistance. The mechanical properties of the resin modified such as the tensile strength and the impact strength are improved by 32.9 MPa and 4.03 kJ /m2 respectively.
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